Abstract: In this study, we present a low interconnection loss antenna-in-package (AiP) using a chip-embedded metal fan-out wafer-level package (mFOWLP) technology for D-band (110–170 GHz) ...
Abstract: As an emerging and competitive candidate, the fan-out package can meet the small form factor, high density and high electrical performance requirements of the state-of-the-art applications ...
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