Flexibility: Applied’s most significant new platform in more than a decade hosts an unprecedented wide variety of chamber types, sizes and configurations, from Applied and partners Intelligence: ...
BEDFORD, Mass. & SEOUL, South Korea--(BUSINESS WIRE)--Silicon wafer manufacturer 1366 Technologies together with its strategic partners, Hanwha Q CELLS Malaysia Sdn. Bhd. and parent company Hanwha Q ...
Electronic devices have become an indispensable part of our lives in our technology-driven world. These devices owe their existence to a crucial component known as the semiconductor wafer. In this ...
Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution ...
Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...
Veeco Instruments and research organisation imec have jointly developed a manufacturing process that enables the integration of barium titanate onto 300mm silicon photonics wafers, addressing a ...
NexWafe’s EpiNex solar wafers achieved 24.4% efficiency on a commercial M6 heterojunction (HJT) cell line, for the first time delivering performance parity with conventional CZ wafers. Modules made ...
The Wafer Process Control Equipment Market, valued at USD 7.93 billion in 2023, is expected to grow to USD 13.15 billion by 2031, exhibiting a CAGR of 6.52% from 2024 to 2031. This growth is driven by ...
Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...
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