New Software Development Kit Brings High-Performance Thermal Simulation And GPU-Accelerated Speed To Integrated Engineering Workflows. MONTREAL, March 11, 2026 /PRNewswire/ - Maya HTT today announced ...

Engineers know that energy modeling is a moving target. Trying to both design sustainable buildings and meet more-stringent government and client-imposed clean energy and carbon reduction goals has ...

Typical 3D thermal simulation of electronics components assumes that all the power consumption the data sheets define is dissipated in the semiconductor. In the case of high current power modules, ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

The figure shows the evolution of the microstructure of the melt pool under the influence of the simulated transient temperature field. Nucleated grains are represented in pink-purple plots, while ...

The electronics industry exists in a continuous state of evolution. The world’s biggest companies are either launching new products, or refining and improving existing ones. In keeping with consumer ...

French scientists have developed a fully coupled opto-electro-thermal model that reportedly predicts solar cell behavior under real operating conditions in a standalone framework. They said the model ...

How in-house-developed and third-party general-purpose simulation tools are limited to a few expert users and aren’t easily shareable. How multiphysics simulation of subsystems can result in an ...

This technical FAQ examines three modeling gaps identified in engineering literature and outlines algorithmic methods to address them.