NextBigFuture

NEO Semiconductor 3D X-DRAM With 8x the Density Of DDR5 Computer Memory

Neo Semiconductor has announced the world’s first 3D stackable DRAM technology, called 3D X-DRAM, that could revolutionize computer memory. Neo estimates 3D X-DRAM can achieve 128Gb density with 230 ...
TweakTown

NEO Semiconductor's new 3D X-DRAM technology is groundbreaking 3D NAND-like DRAM

NEO Semiconductor has announced that it has developed the "world's first 3D NAND-like DRAM cell array," which aims to increase DRAM chip density using established 3D stacking technology. Designed to ...
TweakTown

Samsung teases 16-layer 3D DRAM with VCT DRAM as a 'stepping stone' for future RAM

VCT (vertical channel transistor) DRAM is one of the first achievements towards this goal, with Samsung expected to complete the initial development of VCT DRAM in 2025, with 3D DRAM hitting the ...
sciencex

Imec Demonstrates Capacitor-less IGZO-Based DRAM Cell With >400s Retention Time

This week, at the 2020 International Electron Devices Meeting, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents a novel dynamic random-access ...