Ansys ANSS announced a partnership with TSMC and Microsoft to develop a solution to analyze mechanical stress in multi-die 3D-IC systems produced using TSMC's 3DFabric advanced packaging. This ...

PITTSBURGH, Oct. 29, 2018 /PRNewswire/ -- With state-of-the-art power and reliability analysis solutions, TSMC and ANSYS (NASDAQ: ANSS) enable customers to confidently develop next-generation ...

Set-Top-Box(STB) SoC designs are extremely complex with multi-million standard cells, higher core utilization of around 70-80 %, and multiple clock domains including high and low frequencies. An ...

System design and system integration have taken on a whole new meaning with the latest trends in mobile and wearable computing. Integrating the compute power formally associated with super-computers ...