Tessera Technologies Inc. has unveiled a tiny stacking package that enables users to mix and match independently tested silicon devices and stack them within a single-chip footprint. The company's ...

Bernstein has identified key players in the chip testing and advanced packaging sector that are positioned to benefit from growing demand for artificial intelligence chips and increasingly complex ...

The limits of monolithic integration, together with advances in chip interconnect and packaging technologies, have spurred the growth of heterogeneous advanced packaging where multiple dies are ...