Taiwan News

Grand Process Technology, Taiwan Tech join forces on semiconductor packaging platform

TAIPEI (Taiwan News) — Grand Process Technology has signed a cooperation agreement with National Taiwan University of Science ...
Design And Reuse

IC Manufacturing and Packaging: The Engine Powering the Digital and AI World

From smartphones and cars to AI data centers, medical equipment, satellites, and industrial automation systems, semiconductor chips are the invisible brain behind every intelligent system. As ...
Taiwan News

Taiwan’s Cheng Mei to expand semiconductor packing materials production

TAIPEI (Taiwan News) — Cheng Mei Materials Technology Chair Sung Yen-i (宋妍儀) said the company is undergoing a transformation ...
Digi Times

Semiconductor materials orders driven by advanced processes, packaging demand

Semiconductor materials distributors are optimistic about operations in the second quarter of 2024, driven by rising semiconductor capacity and long-term demand for AI and High-Performance Computing ...
DIGITIMES

Former TSMC SVP leads V5 Technologies' AI inspection push in semiconductor packaging

V5 Technologies, a leading maker of advanced semiconductor inspection equipment centered on AI algorithms, is capitalizing on the explosive growth in advanced process and packaging demand. The company ...
The Manila Times

ACM Research Receives Multiple Advanced Packaging Equipment Orders from Leading Global Customers

FREMONT, Calif., Feb. 26, 2026 (GLOBE NEWSWIRE) -- ACM Research, Inc. ("ACM”) (NASDAQ: ACMR), a leading supplier of wafer and ...
AZ Central

ASU-related projects nab $1.2 billion for new research tied to semiconductor packaging

Arizona State University-affiliated research programs and laboratories will receive $1.2 billion in new funding for semiconductor packaging, winning two of four new national awards announced by the ...