This issue of PowerBites looks at how industries use renewable energy to add green to their bottom lines, how advanced ...
Dublin, Jan. 21, 2026 (GLOBE NEWSWIRE) -- The "Power Module Packaging - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2026-2031)" has been added to ResearchAndMarkets.com's ...
A stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by one-fold, SiC power modules allow for ...
A new technical paper titled “Liquid Metal Fluidic Connection and Floating Die Structure for Ultralow Thermomechanical Stress of SiC Power Electronics Packaging” was published by researchers at ...
GaN-, and silicon-based power transistors, modules, and other basic building blocks for more robust, efficient, and ...
Infineon is putting 1,200V and 2,000V SiC mosfet half bridges into 62mm module packaging. “The package enables the use of SiC for mid-power applications from 250kW, where silicon reaches the limits of ...
(MENAFN- GlobeNewsWire - Nasdaq) Key market opportunities exist in the rapid growth and deployment of advanced SiC and GaN power devices within new energy vehicles, driven by increasing sales of 800V+ ...
EasyPack 1B and EasyPack 2B 1200 V power modules from Infineon Technologies integrate CoolSiC silicon carbide MOSFETs for energy-efficient electric vehicle (EV) charging stations and uninterruptible ...
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