Today’s electronic packages have high clock speeds (multi-gigahertz range), fine pin densities (below 0.4-mm pitch), and high pin counts (over 2000). When assembled onto a printed-circuit board (PCB), ...
Interconnects for advanced packaging are at a crossroads as an assortment of new package types are pushing further into the mainstream, with some vendors opting to extend the traditional bump ...
Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...
Impact of PCB plating Finish on Elastomer Socket Technology Ila Pal – Ironwood Electronics Introduction Today’s electronic packages have high clock speeds (multi GHz range), fine pin densities (below ...
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