Image transfer, also known as photolithography (or simply, lithography), plays a crucial role in defining the circuit patterns on a panel. With photolithography, IC substrate manufacturers can ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

FREUDENSTADT, Germany, March 04, 2026 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ: SHMD) has successfully delivered the first specialized InfinityLine H+ system designed for Panel-Level Packaging (PLP) ...

No matter how you get your news, it seems like everyone is talking about AI – and it’s either going to usher in a new era of productivity or lead to the end of humankind itself. Regardless, the AI era ...

Onto Innovation ONTO recently unveiled its glass substrate suite encompassing the JetStep X500 panel-level packaging lithography system and the Firefly G3 sub-micron automatic metrology and inspection ...

For years, many in the semiconductor industry have focused on the march toward advanced nodes. As these nodes have decreased in size, the size of input/output (I/O) bumps on the chip has grown smaller ...

While semiconductor lithography gets the bulk of the attention in chipmaking, other processes are equally important in producing working integrated circuits (ICs). Case in point: packaging. An IC ...

The Global Electronics Association has published a new international standard, IPC‑6921, establishing formal requirements and acceptance criteria for organic integrated circuit (IC) substrates used in ...

Innolux will remodel a 3.5G LCD panel factory to house an IC packaging line, with production to begin in second-half 2023, according to company president James Yang. Innolux has been developing FO-PLP ...

Cuts carbon dioxide emissions from its production by 50%—equivalent to planting 1.3 million trees annually. Boosts durability by up to three times for secure information recognition even with ...