The expanded partnership targets growth in automated corrugated packaging.

Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology Over the years, IBM has accumulated R&D and manufacturing technologies for ...

European tech company Fresh Inset introduces its Vidre+ Complex application in the US, which is designed to extend produce freshness, quality, appearance and nutrient value, without disrupting brands’ ...

Packaging is more than a product vessel. It serves as a strategic tool for storytelling, trust-building, and delivering immersive brand experiences. Retailers and brands that leverage packaging as a ...

The packaging industry plays a pivotal role in product protection, consumer convenience, and, more recently, in environmental ...

Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of ...

The push for sustainable packaging solutions has never been more urgent. As the environmental impact of packaging waste becomes clearer, businesses and consumers are seeking out innovative materials ...

Nvidia Corporation is set to implement a new advanced packaging technology called Chip-on-Wafer-on-Platform PCB (CoWoP) for its next-generation GR150 AI GPU, expected to launch in 2027. This approach ...

South Korean foundry SK Key Foundry and semiconductor packaging and testing specialist LB Semicon have jointly developed "Direct RDL," a key semiconductor packaging technology that promises to advance ...

Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).

Takeout and to-go order volumes have skyrocketed, bringing new guests to the quick-service restaurant segment. At the same ...