Photon Design has announced that its FIMMWAVE photonic simulation software played a key role in enabling Photonect's development of an epoxy-free, fibre-to-chip optical interconnect technology ...

Comprised of judiciously engineered microscopic photonic structures with subwavelength features, the concept of metasurface and metamaterials have proven fruitful results in the realm of meta-optics.

Co-packaged optics (CPO) technology can integrate photonic integrated circuits (PICs) with electronic integrated circuits (EICs) like CPUs and GPUs on a single platform. This advanced technology has ...

A technical paper titled “Unlocking the monolithic integration scenario: optical coupling between GaSb diode lasers epitaxially grown on patterned Si substrates and passive SiN waveguides” was ...

(Nanowerk Spotlight) The concepts of metamaterials and metasurfaces have spawned massive novel applications in free-space optics. However, recent research also indicates that they possess prominent ...

Photonic integrated circuits consist of a series of interconnected photonic integrated devices, which have the advantages of low cost, low power consumption, high speed, large bandwidth, and high ...

Commercialization has started for network switches based on co-packaged optics (CPO), which are capable of routing signals at terabits per second speeds, but manufacturing challenges remain regarding ...

Researchers have developed new polymer materials that are ideal for making the optical links necessary to connect chip-based photonic components with board-level circuits or optical fibers. These ...