Google researchers have revealed that memory and interconnect are the primary bottlenecks for LLM inference, not compute power, as memory bandwidth lags 4.7x behind.
TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, has successfully developed a prototype of a large-capacity, high-bandwidth flash memory module essential for large-scale ...
JEDEC has published the official HBM4 (High Bandwidth Memory 4) specification under JESD238, a new memory standard aimed at keeping up with the rapidly growing requirements of AI workloads, ...
The debut of DeepSeek R1 sent ripples through the AI community, not just for its capabilities, but also for the sheer scale of its development. The 671-billion-parameter, open-source language model’s ...
Weaver—the First Product in Credo’s OmniConnect Family—Overcomes Memory Bottlenecks in AI Inference Workloads to Boost Memory Density and Throughput Credo Technology Group Holding Ltd (Credo) (NASDAQ: ...
Companies Sign Memorandum of Understanding to Establish HBF Memory Technology Specification MILPITAS, Calif.--(BUSINESS WIRE)-- Sandisk Corporation (SNDK) today announced it has signed a landmark ...
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