Flip-chip bonding is the process of bonding on-chip electrodes to printed circuit board (PCB) electrodes using Au bumps. The bond strength influences the circuit’s conductivity directly, without the ...

Undetected bonding pressure variations can result in poor or open flip chip connections, reducing yield and long-term reliability while raising costs. Maintaining a uniform distribution of bonding ...

Fujitsu Limited announced that it has developed new technology that enables formation of ultrafine pitch 35 micron (center-to-center distance of bumps) solder bumps (*1), and high-precision flip-chip ...

Bumping technologies for advanced semiconductor packaging have evolved significantly to address the challenges posed by shrinking contact pitches and the limitations associated with conventional ...