As semiconductor manufacturers aim to produce devices at the 5-nanometer node, the ability to find tiny defects created inadvertently during the fabrication process becomes harder. In addition, there ...

Today's systematic and more subtle random defects are not only decreasing yields, but are also increasing the number of test escapes, or defective parts per million (DPPM) shipped out. One of the ...

A defect in a semiconductor chip may be smaller than a human hair but can create big problems in your everyday life, from crippling your car's steering to making your laptop more susceptible to ...

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...

Detecting sub-5nm defects creates huge challenges for chipmakers, challenges that have a direct impact on yield, reliability, and profitability. In addition to being smaller and harder to detect, ...

An international research team has pioneered a new technique to identify and characterize atomic-scale defects in hexagonal boron nitride (hBN), a two-dimensional (2D) material often dubbed 'white ...

Concrete structures like roads and bridges require nondestructive testing methods to identify interior defects without destroying their structure. Most methods send sound waves into the material and ...

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