An oscilloscope and a device under test (DUT) constitute a de-facto system. In it, the most overlooked element is the interface between the two: the oscilloscope’s probes. Test personnel simply grab ...

Scanning Capacitance Microscopy (SCM) and Scanning Spreading Resistance Microscopy (SSRM) are both established scanning probe-based techniques for two-dimensional carrier profiling. It was mainly the ...

Capacitive displacement sensor’s touch-free nature makes it ideal for fragile surfaces and high-speed machinery.

Over the past decade, demand for nano-electrical characterization has rapidly increased due to the continuous miniaturization of electronic devices. The semiconductor and microelectronics industries ...

Capacitance-voltage (C-V) testing is widely used to determine semiconductor parameters, particularly in MOSCAP and MOSFET structures. However, other types of semiconductor devices and technologies ...

Imec has developed a new failure analysis method to localize interconnection failures in 2.5D/3D stack die with through-silicon vias (TSVs). This technique is called LICA, which stands for ...

AMS has announced a configurable capacitive sensing front end which allows speed and resolution to be traded to optimise designs. Called PCap04, it can capture and digitise 50,000 times per second at ...