Glass substrates are gaining attention as a structural alternative to organic build-up films/cores in advanced semiconductor ...
The rise of artificial intelligence (AI) and the new energy / autonomous vehicle industry presents both challenges and exciting opportunities for the printed circuit board (PCB) and packaging ...
Our appetite for new gadgets is resulting in a huge e-waste problem, with just a fraction of the 50 million tonnes of tech thrown away each year being recycled. Looking to tackle a significant part of ...
Kyocera Corporation (President: Shiro Sakushima; "Kyocera") today announced that it is commercializing a new multilayer ceramic core substrate for advanced semiconductor packages, ...
Conventional PCB manufacturing—which is wasteful, energy intensive, and harmful to the environment—increasingly calls for electronics recycling to reduce material waste and energy requirements through ...
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