Kenji Hata (Prime Senior Researcher), the Nanotube Research Center (NTRC; Director: Sumio Iijima) of the National Institute of Advanced Industrial Science and Technology (AIST; President: Ryoji ...

Copper plating has been extensively employed in the fabrication of embedded packaging to reach high-density, high-speed, high performance electronic products. With through holes (TH) as well as blind ...

Lithium metal exhibits great promise in terms of anode materials for the next-generation high-energy-density batteries. However, the problems with dendrite development and significant volume ...

Electroplating intermediates refer to a class of fine chemicals used as electroplating additives. Unlike the salt used in the plating production process, the electroplating intermediate is an additive ...