Customers can now access more capabilities and capacity for expanded production methods, simplifying custom mechanical sourcing. SAN FRANCISCO, Jan. 17, 2024 /PRNewswire/ -- Fictiv, a global ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

Predominantly, if the metal part used in compression molding is tension or compression loaded, a ratio of metal part thickness to its extensional modulus, multiplied by the Bulk Molding Compound (BMC) ...

If all goes as forecast, this summer processor Owens-Illinois will begin commercial processing of compression molded PET preforms. The Toledo, OH company says it has taken shipment of a compression ...

Chopped prepreg molding compound (CPMC), a relatively new material form resembling molding compounds made from chopped resin impregnated tow, provides design and processing engineers various benefits ...

The hybrid-composite rear load floor uses unidirectional (UD) thermoplastic tapes plus direct-long-fiber thermoplastic (D-LFT) composites. Thermoplastic tapes provided high stiffness/strength in a ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Two of the biggest challenges in thermoplastic-composite molding are the high cost of metal tooling and the long lead times required to produce tools. Aside from the complexity of parts these ...