In southern Taiwan, suppliers once tied to steel, plastics, and display panels are pivoting toward chipmaking as booming AI demand and geopolitical risks push chipmakers to localize sourcing.

Global semiconductor equipment suppliers are accelerating their push into advanced packaging. They are positioning back-end ...

Lam Research powers AI chipmaking with leading etch/deposition tools and recurring service revenue. Click here to find out ...

With the consumer electronics market approaching saturation, panel manufacturers from Taiwan and China are seeking new avenues for growth. Firms like BOE and Innolux are shifting toward advanced ...

SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

Apple Inc. today announced that it will become the first and largest customer of a $2 billion chip packaging facility Amkor Technology Inc. is building in Arizona. The facility will process chips that ...

FREMONT, Calif., Nov. 15, 2022 /PRNewswire/ -- Lam Research Corp. (Nasdaq: LRCX) today announced that it has completed the acquisition of SEMSYSCO GmbH, a global provider of wet processing ...

TOKYO/SEOUL, March 31 (Reuters) - South Korea's Samsung Electronics Co Ltd 005930.KS is considering setting up a chip test line in Japan, five people said, to bolster its advanced packaging business ...

Onto Innovation and Kulicke & Soffa both had a big year in 2022, but they're now down in the dumps. Despite a cyclical downturn, these two equipment makers look like they could have another surge of ...