Ansys® Redhawk-SC™ and Ansys® Totem™ power integrity platforms are certified for TSMC's industry-leading N3 and N4 process technologies TSMC's certifications will help customers speed design flow ...
Ansys and TSMC extend partnership to deliver high-speed and high-capacity power integrity signoff design solutions spanning 16nm to 5nm processes PITTSBURGH, May 6, 2020 /PRNewswire/ -- Ansys (NASDAQ: ...
Ansys (ANSS) and TSMC deliver a high-fidelity multiphysics solution to address design challenges for artificial intelligence (AI), datacenter, cloud, and high-performance computing (HPC) chips The ...
Existing Ansys capabilities with NVIDIA Omniverse platform supercharge 3D integrated circuit (3D-IC) design by enabling designers to optimize semiconductor chips within the context of a ...
Ansys (NASDAQ: ANSS) achieved certification of its cutting-edge multiphysics signoff solutions for TSMC’s advanced N3 and N4 process technologies. This enables joint customers to meet critical power, ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results